PHONEFIX Multifunctional Desoldering Station For iPhone X-16PM Option:BA13 X-15PM set (7pcs) M-IPXS stencil Kit (0

M-IPXS stencil Kit (0

Repair steps :

Reballing BGA chip temperature 180℃-200℃

Only one function setting bottom conveniently

PHONEFIX Multifunctional Desoldering Station For iPhone X-16PM Option:BA13 X-15PM set (7pcs) M-IPXS stencil Kit (0PHONEFIX BA13 Multifunctional Desoldering Station L2024 Soldering pre heating Platform for iPhone X 16 Pro Max Middle Layer Board Repair. PHONEFIX BA13 heating module also compatible with Mijing iRepair MS1 desoldering preheating platform for iPhone X 16 Pro Max motherboard CPU IC heating disassembly and glue removal. Features: PHONEFIX BA13 pre heating station for iPhone X XS XS Max 11 11Pro 11 Pro Max 12 12 mini 12Pro 12 Pro Max 13 13mini 13 Pro 13