MIJING Z22MAX Reballing Platform/Glue Removal for iPhone Android Screwdriver Tools Support Chinese and English menu

Support Chinese and English menu language (default English)

Using a new type of magnetic power original positioning

making it compatible with iPhone motherboards and Android phone motherboards for repair

Once iron reaches temperature (not too high

MIJING Z22MAX Reballing Platform/Glue Removal for iPhone Android Screwdriver Tools Support Chinese and English menuMIJING Z22 MAX multifunctional BGA reballing platform and glue removal station for precision CPU chip repair on iPhone 11 17 Pro Max and various Android phones, includes chip tinning soldering and IC adhesive removal functions. MIJING Z22MAX features a magnetic platform for securing BGA stencils and spring loaded locking mechanism that automatically adapt to various chip specifications such as iPhone CPU A13 A19 Pro, Qualcomm, MediaTek, Kirin, RAM